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xPCB Layout - Version 116.0.506.6156
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Job Directory:        D:\Compulab VX.2\FT-M2E\PCB\

Design Status Report: D:\Compulab VX.2\FT-M2E\PCB\LogFiles\DesignStatus_01.txt

Sun Jan 26 09:31:21 2020

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DESIGN STATUS
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Board Size Extents  ............ 22 X 24.33 (mm)
Route Border Extents  .......... 21 X 23.26 (mm)
Actual Board Area  ............. 535.26 (mm)
Actual Route Area  ............. 488.46 (mm)

Placement Areas: Name            Available         Required          Required/Available
                 Entire Board    1,070.52 Sq. (mm) 499.61 Sq. (mm)   46.67 %

Pins  .......................... 245
Pins per Route Area  ........... 0.5 Pins/Sq. (mm)

Layers  ........................ 4
    Layer 1 is a signal layer
        Trace Widths  .......... 0.12, 0.12, 0.18, 0.2, 0.25, 0.3, 0.38
    Layer 2 is a Positive Plane Layer with nets
        GND
        Trace Widths  .......... 0.51
    Layer 3 is a Positive Plane Layer with nets
        GND
        Trace Widths  .......... 0.51, 1.02
    Layer 4 is a signal layer
        Trace Widths  .......... 0.12, 0.12, 0.2, 0.25, 0.38

Nets  .......................... 38
Connections  ................... 155
Open Connections  .............. 0
Differential Pairs  ............ 4
Differential Pair Names:   CLK_PCIE_N   CLK_PCIE_P
                           PCIE0_RXN   PCIE0_RXP
                           PCIE0_TXN   PCIE0_TXP
                           PCIE0_TXN_C   PCIE0_TXP_C
                           
Percent Routed  ................ 100.00 %

Netline Length  ................ 0 (mm)
Netline Manhattan Length  ...... 0 (mm)
Total Trace Length  ............ 468.31 (mm)

Trace Widths Used (mm)  ........ 0.12, 0.12, 0.18, 0.2, 0.25, 0.3, 0.38, 0.51, 1.02
Vias  .......................... 99
Via Span  Name                   Quantity
   1-4    VIA8_pad18_sm top,bott 5
          VIA8_pad18             94

Teardrops....................... 0
    Pad Teardrops............... 0
    Trace Teardrops............. 0
    Custom Teardrops............ 0
Tracedrops...................... 0

Virtual Pins.................... 0
Guide Pins ..................... 0

Parts Placed  .................. 57
    Parts Mounted on Top  ...... 50
        SMD  ................... 40
        Through  ............... 0
        Test Points  ........... 0
        Mechanical  ............ 10
    Parts Mounted on Bottom  ... 7
        SMD  ................... 7
        Through  ............... 0
        Test Points  ........... 0
        Mechanical  ............ 0
    Embedded Components ........ 0
        Capacitors ............. 0
        Resistors .............. 0
    RF Shapes .................. 0

    Edge Connector Parts  ...... 0

Parts not Placed  .............. 0

Nested Cells  .................. 0

Jumpers  ....................... 0

Through Holes  ................. 107
    Holes per Board Area  ...... 0.2 Holes/Sq. (mm)
Mounting Holes  ................ 8

Wirebonds
    Bondpads ................... 0
    Bond Wires ................. 0